PDF资料 > AMKOR [Amkor Technology]
厂商 | 型号 | 描述 | 页数 | 下载 | 预览 |
---|---|---|---|---|---|
AMKOR |
CMCM | Ceramic Multi-Chip Module Package | 1 页 | ||
AMKOR |
CLGA | Ceramic Land Grid Array Package | 1 页 | ||
AMKOR |
CVBGA | ChipArray? Packages | 2 页 | ||
AMKOR |
CTBGA | ChipArray? Packages | 2 页 | ||
AMKOR |
CABGA | ChipArray? Packages | 2 页 | ||
AMKOR |
CERPAK | Ceramic Pack | 1 页 | ||
AMKOR |
CERDIP | Ceramic Dual-Inline Package | 1 页 | ||
AMKOR |
CDIP | Ceramic Dual-Inline Package | 1 页 | ||
AMKOR |
CBGA | From innovative designs and expanding package offerings, Amkor provides a platform from prototype-to-production. | 1 页 | ||
AMKOR |
CSPNL | Wafer Level Packaging | 2 页 |