PDF资料 > AMKOR [Amkor Technology]
厂商 | 型号 | 描述 | 页数 | 下载 | 预览 |
---|---|---|---|---|---|
AMKOR |
SSOP | Shrink Small Outline, Quarter-Size Small-Outline Packages | 2 页 | ||
AMKOR |
SO8-FL | Interconnect - Cu clips technology for better electrical and thermal | 2 页 | ||
AMKOR |
FCBGA | Package sizes from 10 mm to 55 mm (60 mm and 65 mm in development) | 2 页 | ||
AMKOR |
PSVFBGA | Package on Package (PoP) Family | 2 页 | ||
AMKOR |
POWERSOP2 | Exceptional performance through the innovative design of PSOPs offer | 2 页 | ||
AMKOR |
PPGA | Plastic Pin Grid Array Package | 1 页 | ||
AMKOR |
PLCC | Amkor?? PLCC IC package portfolio provides | 2 页 | ||
AMKOR |
PBGA | Innovative designs and expanding package offerings provide a platform from prototype-to-production | 2 页 | ||
AMKOR |
MQFP | Amkor?? MQFP IC package portfolio provides | 2 页 | ||
AMKOR |
MQFPPOWERQUAD2 | Exceptional thermal and electrical performance by design include the following | 2 页 |