PDF资料 > AMKOR [Amkor Technology]
厂商 | 型号 | 描述 | 页数 | 下载 | 预览 |
---|---|---|---|---|---|
AMKOR |
WLCSP | Wafer Level Processing and Die Processing Services | 2 页 | ||
AMKOR |
DFN | Saw MLF PEL (Plated End Lead) Package | 3 页 | ||
AMKOR |
SON | Saw MLF PEL (Plated End Lead) Package | 3 页 | ||
AMKOR |
QFN | Saw MLF PEL (Plated End Lead) Package | 3 页 | ||
AMKOR |
POWERSOP | Power Small Outline Package,PowerSOP | 2 页 | ||
AMKOR |
MLF | Saw MLF PEL (Plated End Lead) Package | 3 页 | ||
AMKOR |
FUSIONQUAD | Increased I/O (116 to 356) in smaller package footprints | 2 页 | ||
AMKOR |
CERAMIC | Glass or solder seal up to 435C | 1 页 | ||
AMKOR |
TSON8-FL | Bare copper leadframe with no plating | 2 页 | ||
AMKOR |
QSOP | Shrink Small Outline, Quarter-Size Small-Outline Packages | 2 页 |