PDF资料 > MOLEX10 [Molex Electronics Ltd.]
厂商 | 型号 | 描述 | 页数 | 下载 | 预览 |
---|---|---|---|---|---|
MOLEX10 |
885236001 | FC/UPC-to-FC/UPC, Singlemode, 9/125關m/G655, Simplex, 3.00mm (.118), Standard Fiber Optic Cable Assembly, 2.0m | 2 页 | ||
MOLEX10 |
90148-1210 | 2.54mm (.100) Pitch C-Grid? PC Board Connector, Single Row, Right Angle, 0.38關m (15關) Gold (Au) Selective, 10 Circuits | 6 页 | ||
MOLEX10 |
90121-0929 | 2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, 9 Circuits, 0.76關m (30關) Gold (Au) Selective Plating | 4 页 | ||
MOLEX10 |
87759-2215 | 2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 22 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free | 6 页 | ||
MOLEX10 |
87918-0201 | 0.60mm (.024) Pitch miniDIMM DDR2 Socket, Surface Mount, Right Angle, 1.8V Key, 200 Circuits, Lead-free | 6 页 | ||
MOLEX10 |
87759-7630 | 2.00mm (.079) Pitch Milli-Grid??Header, Surface Mount, Vertical, 16 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, with Pick-and-Place Cap | 6 页 | ||
MOLEX10 |
90136-2315 | 2.54mm (.100) Pitch C-Grid III??Header, Single Row, Right Angle, Shrouded, 15 Circuits, 0.76關m (30關) Gold (Au) Selective Plating | 5 页 | ||
MOLEX10 |
90143-0034 | 2.54mm (.100) Pitch C-Grid III??Modular Crimp Housing, Dual Row, 34 Circuits | 2 页 | ||
MOLEX10 |
90136-1220 | 2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, Shrouded, 20 Circuits, 0.38關m (15關) Gold (Au) Selective Plating | 4 页 | ||
MOLEX10 |
90136-1115 | 2.54mm (.100) Pitch C-Grid III??Header, Single Row, Vertical, Shrouded, 15 Circuits, 4關m (160關) Tin/Lead (Sn) over Nickel (Ni) | 4 页 |