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PDF资料 > MOLEX5 [Molex Electronics Ltd.]
| 厂商 | 型号 | 描述 | 页数 | 下载 | 预览 |
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MOLEX5 |
0014450612_17 | 2.54mm Pitch SL Insulation Displacement Connector Assembly, Male, Single Row | 2 页 |
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MOLEX5 |
70634-0022 | 2.54mm Pitch SL??Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 23 Circuits, Tin (Sn) Plating | 2 页 |
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MOLEX5 |
70634-0021 | 2.54mm Pitch SL??Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 22 Circuits, Tin (Sn) Plating | 2 页 |
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MOLEX5 |
70634-0020 | 2.54mm Pitch SL??Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 21 Circuits, Tin (Sn) Plating | 2 页 |
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MOLEX5 |
70634-0019 | 2.54mm Pitch SL??Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 20 Circuits, Tin (Sn) Plating | 2 页 |
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MOLEX5 |
71308-0220N | 2.54mm Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 20 Circuits, 0.76關m Gold (Au) Selective Plating, without PCB Locator Pegs | 2 页 |
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MOLEX5 |
70634-0018 | 2.54mm Pitch SL??Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 19 Circuits, Tin (Sn) Plating | 2 页 |
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MOLEX5 |
70634-0088 | 2.54mm Pitch SL??Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 19 Circuits, 0.76關m Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating | 2 页 |
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MOLEX5 |
70634-0017 | 2.54mm Pitch SL??Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 18 Circuits, Tin (Sn) Plating | 2 页 |
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MOLEX5 |
71308-0218N | 2.54mm Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 18 Circuits, 0.76關m Gold (Au) Selective Plating, without PCB Locator Pegs | 2 页 |
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